Liquid-phase deposition of single-phase alpha-copper-indium-diselenide
نویسندگان
چکیده
منابع مشابه
Template electrodeposition of single-phase p- and n-type copper indium diselenide (CuInSe2) nanowire arrays.
CuInSe(2) nanowire arrays were fabricated by electrodeposition from aqueous solutions of copper sulfate, indium sulfate, selenium dioxide, and citric acid, using anodic alumina membranes as templates. X-ray diffraction patterns showed that the wires were single phase (chalcopyrite structure) but polycrystalline, and a band gap of ∼1 eV was obtained from optical measurements. TEM and SEM confirm...
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3 To my beloved parents and family 4 ACKNOWLEDGMENTS Dr. Crisalle is the chair of my supervisory committee and I express my sincere appreciation for his guidance and constant encouragement through the last five years. I am also obliged to thank Dr. Hoflund, Dr. Svoronos and Dr. Eisenstadt for their valuable discussions and serving as my research committee members. Of course my gratitude should ...
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DENSIFICATION AND MICROSTRUCTURE CHARACTERISTICS OF A PREALLOYED ALPHA BRASS POWDER PROCESSED BY LIQUID PHASE SINTERING
The rapidly solidified prealloyed alpha brass powder with a size range of 40 to 100 μm produced by water atomization process was consolidated using liquid phase sintering process. The relationships between sintering temperature, physic-mechanical properties and microstructural characteristics were investigated. Maximum densification was obtained at 930 °C, under 600 MPa compacting pressure,...
متن کاملLiquid-phase gallium-indium alloy electronics with microcontact printing.
Liquid-phase electronic circuits are patterned on an elastomer substrate with a microcontact printer. The printer head dips into a pool of a liquid-phase gallium-indium alloy, e.g., eutectic gallium-indium (EGaIn) or gallium-indium-tin (Galinstan), and deposits a single drop on a silicone elastomer substrate. After patterned deposition, the liquid-phase circuit is sealed with an additional laye...
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ژورنال
عنوان ژورنال: Materials Science and Engineering: B
سال: 2005
ISSN: 0921-5107
DOI: 10.1016/j.mseb.2004.05.057